The 10 nm Kirin 970 appears before its official launch with 1.2 Gbps LTE

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Huawei has prepared us for a chip announcement at IFA, and now we know what that sassy tweet was about. The company will introduce its in-house chipset Kirin 970, developed by HiSilicon and built by the 10 nm process by TSMC.

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Although Huawei is about to reveal the Kirin 970 on September 2, all the info was already leaked by Roland Quandt on Twitter. The chipset will have 5.5 billion transistors, 8 CPU cores with a maximum frequency of 2.4 GHz, and 12 GPU cores. Huawei also implemented an innovative HiAI mobile computing architecture for better AI performance.

The LTE modem supports the impressive Cat18 connection with up to 1,2 Gbps speeds. These technologies are firsts for mobile chipsets, and they are probably going to appear as early as October 16 when the Huawei Mate 10 is going to be announced.

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