MediaTek unveils Helio P70: a faster version of the P60

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MediaTek is following up on its AI-centric P60 chipset with a new more polished platform. The Helio P70 promises a 10-30% boost in AI tasks and a 13% improvement on general tasks. That said, things haven’t changed that much from the P60.

The new chipset is built on the same 12nm process, but it runs both its CPU and its GPU at higher clock speeds. On the processor side, the four big cores, Cortex-A73, now run at 2.1GHz. Meanwhile, the Mali-G72 MP3 GPU is now clocked at 900MHz. There’s a table below with more details.

The Helio P70 claims to use up to 35% less power in popular games compared to the P60, despite the bump in performance. Energy Aware Scheduling+ is a thermal management solution that promises to lower operating temperature by up to 4.5°C (the P60 had the non-plus version of this tech).

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The chipset has hardware to do the heavy lifting when it comes to camera effects. Bokeh is rendered at 24fps, a 3x improvement in performance. It has a hardware warping engine for

low-power electronic image stabilization (MediaTek says it saves 23mA per second vs. doing it on the GPU).

The P70 has triple ISPs that can handle a 24+16MP dual camera or a single 32MP camera. supports up to 8GB of LPDDR4X RAM (1,800MHz). It can use UFS 2.1 or eMMC 5.1 storage. The built-in modem supports two SIMs, VoLTE and Band 71 (600MHz), which is popular in the US.

	Helio P60	Helio P70
Process	12nm (TSMC)	12nm (TSMC)
Big CPU cores	4x Cortex-A73 at 2.0GHz	4x Cortex-A73 at 2.1GHz
Small CPU cores	4x Cortex-A53 at 2.0GHz	4x Cortex-A53 at 2.0GHz
GPU	Mali-G72 MP3 at 800MHz	Mali-G72 MP3 at 900MHz
RAM	Up to 8GB 1,800MHz LPDDR4X	Up to 8GB 1,800MHz LPDDR4X
Storage	UFS 2.1 / eMMC 5.1	UFS 2.1 / eMMC 5.1
Camera	20+16MP or 32MP	24+16MP or 32MP
Screen	2,400 x 1,080px	2,400 x 1,080px
4G LTE	Cat. 7 (DL) / Cat. 13 (UL)	Cat. 7 (DL) / Cat. 13 (UL)

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